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Sun, 27 May 2018 22:53:53 +0000
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Thu, 24 May 2018 17:14:56 +0000
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Thu, 24 May 2018 12:47:15 +0000
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Thu, 24 May 2018 11:13:50 +0000
In his first congressional testimony since becoming NASA administrator a month ago, Jim Bridenstine sought to reassure Senate appropriators about the status of several agency programs threatened with cancellation, as well as his own views on climate change. SpaceNews.com
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Wed, 23 May 2018 23:31:37 +0000
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The U.S. Federal Communications Commission rejected a Eutelsat application for a satellite that would use the same spectrum as one planned by Intelsat. SpaceNews.com
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An NBN executive estimated the business service will use 15 percent of the capacity on the Sky Muster satellite system. SpaceNews.com
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  • CV: Thermal engineer

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    Personal information
     Name:<withheld>
     Age:<withheld>
     Country:<withheld>
     Location:<withheld>
    Contact information
     Email:<withheld>
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    Candidate Profile
     Date Submitted:15-04-2014
     Last Modified:16-04-2014 (08:36)
    Job information
     Current job:Thermal engineer
     Employment Term:Temp/Contract
     Job location:US only
     Date available:immediately
     Industry:Satellite Manufacturers and Subcontractors
     KeywordsSatellite Thermal Control, Heat Transfer, Numerical Analysis
    CV


     Residency Status: US Citizen

     

    Accomplishments:

    1.   Worked on thermal design and analysis of geosynchronous satellites of Indian Space Program at ISRO for 15 years as senior thermal scientist.

    2.   Thermal system design of high power density components of geo-synchronous satellites.

    3.   Strong programming experience in FORTRAN and C on UNIX based workstation such as IBM RS6000. Worked on various CAD packages such as AutoCAD, SDRC-IDEAS.

    4.   Thermal analysis of some of the critical components of the spacecraft for both transfer and in-orbit conditions.

    5.   Thermal control design using MLI, OSR, Al-blocks and heat pipes.

    6.   Thermal control issues like optical property degradation of materials such as OSR, MLI, low emittance tape, black and white paints have been studied.

    7.   Experience in thermal vacuum testing of satellites: Package thermal qualification level testing (hot and cold soak testing and thermal cycling) and on-orbit testing.

    8.   Transfer orbit as well as on-orbit temperature control of geo-synchronous satellite.

    9.   Post launch thermal analysis: thermal model correction.

    10. As a part of my Ph.D. thesis, extensive research has been conducted to develop techniques and algorithms to optimize the design of thermal control system of the spacecraft. This technique is found to be highly useful in improving the thermal performance of the geo-synchronous satellites. Results of these studies are published in several reputed international journals.

    11. Authored 5 technical reports (Department of Space, Government of India).

    12. Authored 4 papers. These are published in the Journal of Spacecraft and Rockets under the publication of American Institute of Aeronautics and Astronautics (AIAA), U.S.A. and Journal of Aerospace Engineering, U.K.

    13. Acted as a referee for the Journal of Aerospace Engineering, U.K.
     

     

    Specialization: Optimization of thermal systems design of spacecraft components using sensitivity analysis.  Expert in analysis and design of thermal control system for the electronic components of spacecraft systemsuch as, TWTA, Battery, Shunt regulator, Solar panel etc.  Expert in developing Mathematical models for any thermal control system. Expert in the topics such as Calculus, Differential equations, Numerical analysis, Linear algebra.

     

    Publications:

    1. Suresha, S., Gupta S.C., and Katti, R.A, "Thermal Sensitivity Analysis of Spacecraft Battery", Journal of Spacecraft and Rockets,AIAA, Vol. 34, No.3, May-June 1997, pp.384-390.

    2. Suresha, S., Gupta S.C., "Calculation of Sensitivities in Thermal Control Systems with Nonlinear inequality Constraints", Journal of Spacecraft and Rockets, AIAA, Vol.35, No. 4, July-August 1998, pp.552-558.

    3. "Effect of discontinuous heat loads during solar eclipse on transient thermal sensitivity analysis", AIAA, Vol. 36, No.6, November-December 1999, pp. 916- 918.

    4. "Thermal Sensitivity Analysis of a 22N Bipropellant Thruster in Spacecraft", Proc Inst Mech Engs, Vol 213 part G, pp.321-335.
     

     

    Professional Experience: 

     

    BAE Systems (TAC Contractor), Santa Clara, CA                        

    Worked as a Vehicle software Engineer. Job involved the electrical system integration and testing of combat vehicles.

    Functionality testing of RTD Sensors:

    RTD sensors were used to activate AFES system in the vehicle. Tested the sensors both in automatic and manual mode. In automatic mode, sensor needs to give feed back to the control unit called RIU depending upon its temperature co-efficient resistance. Subsequently RIU system has to drive the AFES.

    Firmware uploading on RIU and other LRUs:

    Uploaded the firmwares on different LRUs (Line replacement units) using respective hardware application tools through Ethernet/RS232 communication  ports. Participated in different system functionality testing relating to low and high voltage systems. Good knowledge of propulsion system of the vehicle. In-depth knowledge on network communication testing tools such as CANoe. Debugging Ethernet and CAN communication issues. Good knowledge on Hybrid Electric Drive.

     

    Uploading and downloading of firmwares on the system using RS32 and Gigabit etthernet communication. Management of system configuration files developed in C++.

     

    Santa Clara University, Santa Clara, CA                (2003-2008)   

                                

    Specializing in logic design and Digital Signal Processing.  Design and Analysis of combinational as well as sequential logic circuits have been studied in depth.  Initially, simple combinational logic circuits have been implemented using Xilinx Spartan FPGA. Subsequently, ALU (Adder/Subtractor) and Comparator designs were realized also with FPGA. 

     Hardware Description Language such as Verilog has been used to capture the schematic. Studied ASIC design philosophy and hardware verification procedures. Also the Digital Signal Processing techniques have been studying with a more emphasize on filtering design. Some of the analog circuits have been analyzed for their frequency response using SPICE tool.

     

    Protnov Computer School,Mountain View, CA            (2001 – 2002)

    Worked on Software QA tests and test automation projects using SILK.

     

    Indian Space Research Organization, India             (1985-2000)

    Worked in ISRO as a Project Manager for GSAT (geo-synchronous satellites) project. During the 15 years of career in ISRO, I worked on many different spacecraft projects as a Scientist, technical consultant and Project Manager.

    Following electronic components have been designed for their temperatures for both transfer as well as in-orbit conditions:
    Shunt regulator, SSPA, TWTA, Antenna, Solar Panel and house keeping packages of INSAT-2E and GSAT-2 satellite of Indian space program.

    Each and every component of the spacecraft has to be maintained under certain temperature regimes during all the phases of the spacecraft such as transfer orbit and in-orbit conditions. To ensure this thermal control system design is envisaged.
    Design of thermal control system for the spacecraft requires the development of mathematical model. Heat transfer in spacecraft systems is dominated by conduction and radiation modes of heat transfer. Mathematical model is developed using lumped parameter approach in conjunction with finite difference technique. Both coarse and detailed mathematical models have been developed depending on the problem such as panel level or package level analysis. Both steady state as well as transient models has been developed. Mathematical model for steady state results in system of algebraic equations and system of differential equations for transient problems. Both these types of equations are solved using numerical approach. Temperatures prediction has been done for transfer orbit as well as on-orbit conditions. Subsequently, temperatures are analyzed to design optimal radiator areas on the satellite equipment panel.

    Design of Thermal Control System for High Power Density Packages
    a) Development of Thermal Mathematical model
    b) Calculation of Steady state and Transient Temperatures :
    Design of thermal control system for high power density packages of the spacecraft such as Traveling Wave Tube Amplifiers (TWTA) and Solid State Power Amplifiers(SSPA) is an uphill task as all these components are to be maintained within a narrow temperature range and subjected to large amount of internal heat dissipation and external heat load boundary. In such situation, thermal management of these components has become an important task. In general thermal system design is envisaged with the help of thermal control systems such as heat pipes, Al- embedded blocks as heat sinks, OSR, MLI, selective tapes etc. In this particular situation, heat pipes, MLI and OSR are used to control the temperature of TWTAs and SSPAs. Heat pipe network has been embedded inside the equipment panel on which power density components are mounted. Surface of the equipment panel facing space is covered with MLI and OSR. Appropriate MLI and OSR sizing have been done to provide optimal radiator area. Surface facing the spacecraft is painted black to have more radiation coupling with spacecraft. Design of these thermal control elements is based on the thermal analysis under consideration. Thermal analysis of packages like these requires a usage of CAD tool such as I-DEAS. I-DEAS is generally available on UNIX workstations such as SGI, IBM and SUN. Simulation component of I-DEAS has been extensively used in this context.

    Master modeler has been used to simulate SSPAs and TWTAs. These components are of different shapes and sizes. Initially sub-parts were created using primitive parts such as sphere, cube, cylinder etc. Heat pipe modeling was also done appropriately. Subsequently all these parts were modified, dimensioned and assembled together to form an object. Once all the objects are created they are stored in library.

    Meshing module has been used to carry out solid mesh or surface mesh on the objects created. Both manual and mapped mesh has been used. Meshing results in the creation of different finite elements. These elements are grouped under different names. Finally all these objects are placed on the spacecraft panel which is also modeled and meshed in a similar fashion.
    Thermal analysis module is used to simulate conduction couplings, radiation couplings, and orbital heating for thermal control elements such as heat pipes, MLI, heat sinks and OSR.
     

    Finally Temperature prediction has been done using I-DEAS TMG. Both steady-state as well as transient temperatures were calculated from the above simulation model for both transfer as well as in-orbit conditions. Subsequently, the temperatures of all the components are analyzed to design optimal radiator areas for the components.

    Development of Interface Program between I-DEAS and Harvard Graphics
    Interface has been developed between I-DEAS and Harvard Graphics using 'C'. This program converts the temperature of I-DEAS stored in .unv file and TEMPF file to a format suitable for X-Y Plot using Harvard Graphics. This program is used for the generation of customized time v/s temperature data.

    Thermal Vacuum Testing for Satellites
    Important packages of the satellites were tested for hot and cold soak and thermal cycling conditions. Also, the thermal performance test has been done to verify the thermal mathematical model. Thermal mathematical model correction has been done based on the analysis of thermal performance test.

    Post-Launch Thermal Analysis of Satellites
    On-orbit temperatures of the packages are compared with the predicted temperatures and subsequently, the thermal mathematical model correction has been done with the help of thermal sensitivity studies.
     

     

    Education:

    Santa Clara University, Santa Clara, CA

    MS in Electrical Engineering                                                                (March. 2008)

    Graduate Certificate Program in Fundamental of  Electrical  Engg.        (Dec.  2004)              

     

    Indian Institute of Science

    Ph.D  in Applied Mathematics                                                                      (Sept.  1999)

     

    Annamalai University                                                                                    (Sept. 1991)

    MS in Physics (Electronics)


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