At least 3 years demonstrated professional experience in structural and thermal design and analysis of spacecraft electronic equipment and/or major sub-assemblies for space applications or experience in mechanical and thermal analysis of mass efficient equipment for high performance applications typified by aerospace, defense, and motorsport.
Proficient in the use of one or more of the following engineering tools for structural and/or thermal analysis: Hypermesh, FEMAP, Ansys Mechanical, ESATAN-TMS, Thermal Desktop, OptiStruct or equivalent.
Strong working knowledge of analysis methodologies as applicable to aerospace applications.
Familiarity with industry standards such as ECSS, MIL-HDBK5/17, NASA etc.
Prior experience undertaking testing and model correlation for vibration and thermal vacuum testing.
Ability to use CAD tools with an emphasis on geometry preparation for analysis.
Organized, methodical, precise, meticulous, and autonomous person able to work across multiple concurrent work streams.
Ease of communicating effectively, good interpersonal skills and ability to integrate into a multidisciplinary and multicultural team.
Beneficial experience and competencies:
Prior experience with analysis of high-power electronic equipment, including PCB level structural, thermal, and fatigue analysis.
Experience working with PCB, RF, and/or antenna designers and exposure to PCB layout and PCB mechanical and thermal design.
Good if the candidate has worked on phased array antenna product.
Basic proficiency with one or more programming languages for the purpose of analysis data processing, e.g.
Python, MATLAB, Perl, VBA etc.
Prior ownership of a complex component or assembly from initial design through high-volume production.
Experience with tools for electronics thermal design such as Flotherm or Icepak.
Job responsibilities
Define, perform, validate, and document structural and thermal analysis using appropriate methodologies which may include a combination of classical hand calculations, empirical, and finite element analysis approaches.
Build, run, and post-process detailed and idealized finite element models of sub-assemblies and components subjected to static, dynamic, and thermal loading.
Provide practical support to hardware development and testing activities in addition to defining test plans and procedures, undertaking test predictions, and completing post-test model correlations.
Collaborate with design and systems engineers to iterate designs using appropriate sizing methods to enable a ‘Design-by-analysis’ approach.
Review and assess mechanical and thermal specifications from customers or SWISSto12 internal teams to establish relevant technical analysis and test plans.
Contribute to technical exchanges with customers, suppliers, and subcontractors.
Occasionally, you will be asked to participate in overall tasks and services inherent to a dynamic fast-growing company.
Don't forget to mention Space-Careers when applying.